Recently, Fu Wenhan, a young faculty member of the Business School, published an academic paper titled Advanced Quality Control for Probe Precision Forming to Empower Virtual Vertical Integration for Semiconductor Manufacturing in Computers & Industrial Engineering (C&IE), the top-tier journal ranked in the first quartile by the Chinese Academy of Sciences. This paper was selected by the globally renowned scientific institution Advances in Engineering (AIE) as a key scientific article and was prominently featured under the title Optimizing Semiconductor Probe Precision Forming: Integrating Design of Experiment, Partial Least Squares, and Genetic Algorithms for Advanced Quality Control. The paper was conducted with the USST as the first affiliation, with Fu Wenhan as the first and corresponding author, Chien Chen-Fu, Chair Professor at Tsing Hua University in Taiwan, and Chen Chi-Hang, Research Assistant, as co-authors.
Circuit probe is crucial for electrically testing for functional defects to determine the known good dies before integrated circuit (IC) packaging. Semiconductor probe forming showing quality characteristics with highly correlated responses, yet little research has been done to develop effective solution for optimizing the parameters for probe precision forming. As IC critical dimensions are shrinking, the present problem for probe precision forming is increasingly challenging and critical for data integrity of circuit probe test for yield enhancement of IC products. Focusing on realistic needs, Fu Wenhan and co-authors aims to develop an effective solution for real-time parameter optimization in light of changing production conditions based on design of experiment, partial least square, and genetic algorithm for advanced quality control to enhance data integrity of circuit probe test. The results of an empirical study have shown that the proposed approach can significantly enhance the effectiveness and efficiency of parameter optimization in real setting. Indeed, the developed solution has been implemented with significant advantages, enabling virtual vertical integration in semiconductor manufacturing.
Advanced quality control framework for Probe precision forming
Paper link：
https://www.sciencedirect.com/science/article/abs/pii/S0360835223004850
AIE report link：
https://advanceseng.com/optimizing-semiconductor-probe-precision-forming-integrating-design-of-experiment-partial-least-squares-and-genetic-algorithms-for-advanced-quality-control/
[About the Journal and Institution]:
Computers & Industrial Engineering is published by Elsevier and is one of the leading journals in the field of industrial engineering. It is currently ranked in the top tier of the engineering category by the Chinese Academy of Sciences, with a recent impact factor of 7.9.
Established in Canada in 2005, Advances in Engineering (AIE) aims to report significant scientific research achievements and innovative technologies. Papers reported by AIE are selected by an international advisory board of experts, with only 20 outstanding papers highlighted weekly across fields including materials, chemistry, electronics, mechanical engineering, nanotechnology, civil engineering, and general engineering (including industrial engineering). The selection rate is within 0.1‰ of all papers published in these fields. AIE receives up to 850,000 reads per month and is followed by major global research institutions and linked by the world's top 50 engineering companies to track the latest breakthrough technological advancements worldwide.
Translated by Li Xiaomei
Reviewed by Liu Weiwei
