Academic/Professional Qualifications 

Ph.D.,   Department of Industrial Engineering, Tsinghua University (Hsinchu),   2017-2019

M.S.,   Department of Computer Science, Amity University (India), 2013-2015

M.S.,   Department of Information and Communication, Delhi University (India),   2009-2011

Bachelor,   Department of Information Technology, Kuvempu University (India), 2005-2009

Career History

Postdoctoral   Fellow, Antai College of Economics and Management, Shanghai Jiao Tong   University, 2019-2021

Adjunct   Assistant Professor, Tsinghua University (Hsinchu), 2019

Research   Assistant, Tsinghua University (Hsinchu), 2016-2017

Engineer,   Nokia Siemens Network (Finland), 2012-2013

Engineer,   Verizon Wireless (USA), 2009

Funding [Principal: 680,000 RMB;   Participant: 840,000 RMB & 1,800,000 NTD]

Principal Investigator：

1. Intelligent Digital Supply Chain   Orchestration and Sustainability, Chinese Science Foundation (2019   Talent-Introduction Program), Advisor: Prof. Dali Zhang，Grant Number:   YJ20190196, Discipline: Management Science and Engineering, 2019—2021.

Principal Participant (Research):

1. Research on The Joint Optimization   Method of Data-Driven Mobile Location Management and Picking Path, National   Natural Science Foundation of China (General Project), Principal   Investigator: Prof. Zhang Dali, 2021-2025.    [Translated from the Chinese language].

2. Research on Human-Machine Cooperation   Mechanism and Human-Machine System Management Decision Optimization for   Medical Services, National Natural Science Foundation of China (Key Project),   Principal Investigator: Prof. Na Geng, Grant Number: 72031007, 2021-2025.   [Translated from the Chinese language].

3. China's Belt and Road   Energy Investment Policy Green Effect Evaluation and Improvement Strategy   Research, China Social Science Foundation General Project, Principal   Investigator: Dr. Li Pin, Grant Number: 20BJY076, 2021-2023. [Translated from   the Chinese language].

4. Development of Unsupervised Machine   Learning Approaches for Intellectual Property Analysis, Ministry of Science   and Technology Taiwan, Principal investigator: Prof. Amy Trappey, 2016-2018.

Principal Participant (Industry):

1. Virtual Reality Exposure Therapy   Study, Chang Gung Hospital Taipei, Principal Investigator: Prof. Amy Trappey,   2019—2021.

2. Intelligence for Competitive Advantage   Study, Fortune Electric Company, Principal Investigator: Prof. Amy Trappey,   2019—2020.

3. Intelligent Conversational   Technologies Specifications Analysis, Information Industry Council Taiwan,   Principal Investigator: Prof. Amy Trappey, 2018.

4. Original Equipment Manufacturer   International Branding Research, Taiwan Economic Research Institute,   Principal Investigator: Prof. Charles Trappey, 2017.

 (1)  Artificial Intelligence for International   Business (MSC. IBRM2. STCOR.0034), SKEMA Business School, France, Fall 2021

(2) Introduction to Relational Database   (46400470), SKEMA Business School, France, Fall 2021.

(3) Advanced Computer Business   Applications (46400360), SKEMA Business School, France, Spring 2021.

(4) Data Base Management System   (10710IEEM316000), Tsinghua University (Hsinchu), Fall 2019

(5) Academic Writing and Presentation   Skills (10730IEEM580100), Tsinghua University (Hsinchu), Summer 2019.

(6) Programming Design and Applications   (10620IEEM214000), Tsinghua University (Hsinchu), Spring 2019.

(7) Data Structures (10630IEEM314000),   Tsinghua University (Hsinchu), Summer 2018.

Publications [Patent: 1; Book:2; SCI: 8;   EI:2; Impact factor (total): 30.21; Citations: 600]

Patent：

Govindarajan, U. H., Lee, C. H., Zhang,   D., & Raut, R. D. (2021). Garbage Detection Method and System Based on   YOLO Network. China Patent, Invention Patent: GW2020I2096. [Translated from   Chinese language].

Book：

Govindarajan, U. H.*, Narang, G., Zivlak,   N., & Yadav, V. S., (2022). Blockchain Technologies in Health Care:   Emerging Trends, Adoption Barriers, and Clinical Use-Cases. Blockchain for   Industry 4.0: Emergence, Challenges, and Opportunities, Computational Methods   for Industrial Applications (CMIA) Series. CRC Press (Taylor & Francis   Group, U.S.A.) [Accepted (Provisionally)].

Govindarajan, U. H.*, Zhang, D., &   Anshita. (2021). Extended Reality for Patient Recovery and Wellness. Extended   Reality for Healthcare Systems: Recent Advances in Contemporary Research.   [Accepted, Print ISBN: 9780323983815, Electronic ISBN: 9780323985390].

Editorial Note：

Singh, P. K., Raut, R. D., Hong, W. C.,   & Govindarajan, U. H. Futuristic Technologies for Intelligent   Manufacturing and Supply Chain Management. IET Collaborative Intelligent   Manufacturing. [Preprint Available Online].

Journals (Selected Papers) ： (* Corresponding   author) 

1. Trappey, A. J., Trappey, C. V.,   Govindarajan, U. H.*, & Sun, J. J. (2021). Patent Value Analysis Using   Deep Learning Models - The Case of IoT Technology Mining for Manufacturing   Industries. IEEE Transactions on Engineering Management, vol. 68, no. 5, pp   1334~1346. [(IF=2.05) (SCI) (Q1: Operations Management) (Cited 13 times)   (Antai College of Economics and Management list top journal category B+)].

2. Yadav, V. S., Singh, A. R., Raut, R.   D., & Govindarajan, U. H.* (2020). Blockchain Technology Adoption   Barriers in The Indian Agricultural Supply Chain: An Integrated Approach.   Resources, Conservation & Recycling, Vol. 161, 104877. [(IF=8.08) (SCI)   (Q1: Environmental Science) (Sino-US Global Logistics Institute list top   journal category B) (Cited 33 times)].

3. Raut, R. D., Gotmare, A., Narkhede, B.   E., Govindarajan, U. H.*, & Bokade, S. U. (2020). Enabling Technologies   for Industry 4.0 Manufacturing and Supply Chain: Concepts, Current Status,   and Adoption Challenges. IEEE Engineering Management Review (Early Access,   DOI: 10.1109/EMR.2020.2987884). [(IF=0.39) (SCI) (Q2: Business Management)   (Cited 14 times)].

4. Govindarajan, U. H., Trappey, A. J.,   & Trappey, C. V. (2019). Intelligent Collaborative Patent Mining Using   Excessive Topic Generation. Advanced Engineering Informatics, vol. 42, pp.   100955. [(IF=3.87) (SCI) (Q1: Information Systems) (Cited 12 times)].

5. Govindarajan, U. H., Trappey, A. J.,   & Trappey, C. V. (2018). Immersive Technology for Human-Centric Cyberphysical   Systems in Complex Manufacturing Processes: A Comprehensive Overview of the   Global Patent Profile Using Collective Intelligence. Complexity. [(IF=2.59)   (SCI) (Q1: Computer Science) (Cited 36 times)].

6. Trappey, A. J., Trappey, C. V.,   Govindarajan, U. H., Sun, J. J., & Chuang, A. C. (2016). A Review of   Technology Standards and Patent Portfolios for Enabling Cyber-Physical   Systems in Advanced Manufacturing. IEEE Access, vol. 4, pp. 7356-7382.   [(IF=4.09) (SCI) (Q1: Engineering) (Cited 150 times)].

7. Trappey, A. J., Trappey, C. V.,   Govindarajan, U. H., Chuang, A. C., & Sun, J. J. (2016). A Review of   Essential Standards and Patent Landscapes for The Internet of Things: A Key   Enabler for Industry 4.0. Advanced Engineering Informatics, vol. 33, pp. 208-229.   [(IF=3.87) (SCI) (Q1: Information Systems) (Cited 259 times)].

Conferences (Selected Papers) ： (* Corresponding   author) [Best paper:1; Best paper finalist:2]

1. Trappey, A. J., Trappey, C. V.,   Govindarajan, U. H.*, & Sharma, A. (2018). Conversational Service Bot   Specifications for Advanced Manufacturing Applications. In Proceedings of the   2018 IEEE International Conference on Advanced Manufacturing (ICAM), Yunlin,   Taiwan, China [Best Paper Award].

2. Trappey, A. J., Trappey, C. V.,   Govindarajan, U. H.*, & Sun, J. J. (2018). Patent Quality Estimation   Using Machine Learning – An Industrial Internet of Things Empirical Study. In   Proceedings of the 2018 International Symposium on Semiconductor Manufacturing   Intelligence (ISMI), Hsinchu, Taiwan, China [Best Paper Award Finalist].

3. Govindarajan, U. H.*, Trappey, A. J.,   & Trappey, C. V. (2016). Investigating Technology and Patent Portfolio of   Lens-Less Cameras in the Context of Industry 4.0. In Proceedings of the 17th   Asia Pacific Industrial Engineering & Management Systems Conference   (APIEMS), Taipei, Taiwan, China [Best Paper Award Finalist].

Fall 2023Python Business Data Analysis and Decision-making 

((2023-2024-1)-13007200-01 Python商务数据分析与决策). 

School: University of Shanghai for Science and Technology (Shanghai).

Spring 2023Data mining ((2022-2023-2)- 13005600-02数据挖掘). 

School: University of Shanghai for Science and Technology (Shanghai).

Fall 2022 International Business Technology Management.

School: Executive Development Program Center (Shanghai).

Fall 2022 Python programming (Python 程序设计- (2022-2023-1)-13007564-2). 

School: University of Shanghai for Science and Technology (Shanghai).

Summer 2022 AI and Citizen Development for International Business. 

School: Emlyon business school (Shanghai).

Winter 2022 Fundamentals of Informations Systems Management (4C2MSI). 

School: Emlyon business school (Shanghai).

Fall 2021 Artificial Intelligence for International Business (MSC.IBRM2.STCOR.0034). 

School: SKEMA Business School (Suzhou).

Note: Evaluation score of 4.20 out of a maximum of 5.

Fall 2021 Introduction to Relational Database (46400470数据库基础与应用). 

School: SKEMA Business School (The International Audit Joint Institute).

Spring 2021 Advanced Computer Business Applications

 (46400360 高级计算机商务应用). 

School: SKEMA Business School (The International Audit Joint Institute).

Note: Top 5% in the department during final evaluation. 

Summer 2019 Academic Writing and Presentation Skills 

(IEEM580100 學術寫作與報告技巧).

School: Tsing Hua University (Hsinchu).

Note: Evaluation score of 4.89 out of a maximum of 5.

 Spring 2019 Programming Design and Applications 

(10620IEEM214000 程式設計與應用). 

School: Tsing Hua University (Hsinchu).

Note: Evaluation score of 4.62 out of a maximum of 5.

Summer 2018 Data Structures (10630IEEM314000 資料結構). 

School: Tsing Hua University (Hsinchu).

Note: Evaluation score of 4.86 out of a maximum of 5.

1.  2020—Present   Associate Editor, IET Collaborative Intelligent Manufacturing Journal.

2.  2022   Core Committee Member, IEEE International Conference on Computer Supported   Cooperative Work in Design (IEEE CSCWD).

3.  Govindarajan,   U. H., Reggie, D., Zhang, D., Narkhede, B. E., Gohel, H., Ezzerouali, A.,   Raut, R. D., & Singh, D. K. (Guest Editors). Business Intelligence: The   CSCW Perspectives. IEEE International Conference on Computer Supported   Cooperative Work in Design, (IEEE CSCWD 2022).

4.  2021   Core Committee Member, International Conference on Artificial Intelligence   and its Applications (ICARTI 2021).

5.  2021   Technical Programme Committee, IEEE International Conference on Computer   Supported Cooperative Work in Design (IEEE CSCWD).

6.  2020   Core Committee Member, IEEE International Conference on Computer Supported   Cooperative Work in Design (IEEE CSCWD).

7.  Govindarajan,   U. H., Trappey, A. J. C., Zhang, D., Lee, C. H., Chang, C. M., Narkhede, B.   E., & Raut, R. D. (Guest Editors). Special Session on Computer Supported   Cooperative Systems Incorporating Immersive Technologies (3D, 360°, VR, AR,   MR, Holography, Cave, Telepresence, Digital Twin, and BCI). IEEE   International Conference on Computer Supported Cooperative Work in Design,   (IEEE CSCWD 2020-2021).

8.  Singh,   P. K., Raut, R. D., Hong, W. C., & Govindarajan, U. H., (Guest Editors).   Special Issue on Futuristic Technologies for Intelligent Manufacturing and   Supply Chain Management. IET Collaborative Intelligent Manufacturing Journal,   2020.

Awards (2014—Present) 

1. Qualification of Master Supervisor in Management Science and Engineering, University of Shanghai for Science and Technology,2023.

2. Shanghai Region Teaching Excellence Award, University of Shanghai for Science and Technology,2023.

3. COVID’19 Shanghai Cluster Containment Work Commendation, University of Shanghai for Science and Technology, 2022.

4. Intermediate Professional Technical Position Certification for Assistant Research, Shanghai Jiao Tong University, 2020.

5. Outstanding Conference Proceeding Paper Cash Award, Tsing Hua University (Hsinchu), Taiwan, China, 2019.

6. Certificate of Appreciation for Internship Program Management, College of Engineering Tsing Hua University (Hsinchu), Taiwan, China, 2019.

7. IEEE Best Research Paper Award, IEEE International Conference on Advanced Manufacturing (ICAM), 2018.

8. Travel Grant, Ministry of Science and Technology, Taiwan, China (attend IIMA, Houston, USA), 2017.

9. Best Paper Award Finalist, International Symposium on Semiconductor Manufacturing Intelligence (ISMI), 2018.

10. Presidents Doctoral Scholarship, Tsing Hua University (Hsinchu), Taiwan, China, 2018.

11. Travel Grant, Ministry of Science and Technology, Taiwan, China (attend ICoIESE, Bandung, Indonesia), 2017.

12. Presidents Doctoral Scholarship, Tsing Hua University (Hsinchu), Taiwan, China, 2017

13. Best Paper Award Finalist, Asia Pacific Industrial Engineering & Management Systems Conference (APIEMS), 2016.

14. Shri. Baljit Shastri Award for Overall Excellence in Engineering, Amity University, 2015.

15. Global Engineering Leadership Scholarship, Tsing Hua University (Hsinchu), Taiwan, China, 2014.